We present the temperature mapping, supported by I-SCAN ™
Texcan has expanded the I -SCAN ™ platform with a new temperature mapping function using thin -layer temperature sensors, enabling the recording of a detailed temperature distribution on the surface - or between two surfaces, where thermal imaging cameras are not able to do it.
This innovative solution integrates I-SCAN software and electronics with a thin-layer temperature sensor, ensuring precise high-resolution thermal analysis in an easy-to-use format. The sensor can be used alone or, depending on the selected package, in combination with the Texcan pressure mapping sensor - enabling the collection of thermal and/or pressure data to obtain a deeper view of the product performance and process optimization.
The most important benefits
Measurement where thermal imaging cameras cannot cope
Accurate temperature measurement in moving components, closed spaces and multilayer materials - even inside closed machines and rotating rollers, where infrared cameras fail. Regardless of whether you work with closed machines, rotating equipment or multi -layered teams, the Texcan temperature detection system provides dynamic, spatial insight into thermal behavior in real time.
insensitive to emission
Unlike infrared cameras, which require emission adjustment to obtain accurate readings, sensors for mapping TEXCAN temperature provide precise, direct measurements regardless of the properties of the material.
visualization of heat spread
Specify how the heat moves through the surface and indicate the critical area to optimize the product design, selection of materials and process control.
Comprehensive insight into data
Real time recording temperature distribution on high resolution surface for a deeper analysis.
Improvement of data collection
Eliminate the embarrassing use of many thermocounts on the surface for many measuring points (192) contained in one trimmed sensor.
Correlation of pressure and temperature
I-scan pressure overlay to reveal the critical relationship between pressure and temperature affecting product performance and reliability.
Smooth integration with i-scan
He works with the existing I-SCAN 9.5 platform, enabling easy adaptation for users already familiar with Texcan pressure mapping technology.
Temperature mapping system technology
| Czujniki | Elektronika | Oprogramowanie |
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Temperature mapping software
I-SCAN software for temperature mapping provides mapping and visualization of real-time temperature for a deeper analysis. Created on the I-SCAN 9.5 platform, TEXCAN offers configurable heat maps, improved calibration and intuitive tools for efficient and accurate data analysis.
software properties
- Simultaneous mapping of temperature and pressure: after starting, users can map, compare and correlate the temperature and pressure distribution on the surface.
- Real -time temperature visualization: displays dynamic temperature distribution maps both in real and registered mode for detailed analysis.
- Chart and application of pressure and temperature: Comparison of pressure and temperature trends to discover critical correlations in material behavior and process efficiency.
- Easy to use interface: It works on Texcan i-SCAN 9.5 software, ensuring a known and easy-to-use work flow for current users.
- Unique temperature gradient scale: provides non -standard heat maps to improve the visualization and analysis of thermal data.
- Improved calibration procedure: provides accurate, repetitive measurements thanks to the intuitive configuration process. *(laboratory heating plates available for calibration as an optional accessory)
application
Energy storage
Analysis of temperature distribution in cells, modules and battery packages during charging /discharge cycles to identify hot points.
Assessment of the effectiveness of insulation layers in temperature management
Packing and production
Verification of heat homogeneity in welding strips during the machine configuration to ensure consistent welds in packaging applications.
Measurement of constant temperature in pressure rollers in laminating and processing processes.
Automotive
Assessment of thermal shield performance to optimize thermal protection in vehicles.
Assessment of electronic heating systems in electric vehicles in terms of efficient climate control in the cabin.
Monitoring of heat dissipation in engines and components operating at high temperatures.
Electronics and semiconductors
Measurement of heat dissipation efficiency between components and heat sinks.
Assessment of uniformity of temperature during the production of semiconductor tiles in terms of semiconductor reliability.
